Super Talent Technology, a leading manufacturer of NAND Flash storage solutions, today announces their fastest 2.5” SSD to date, the SATA3 TeraNova. Targeted at the Pro/Enthusiast seeking extreme performance, the TeraNova is the fastest 2.5” SSD that SuperTalent has released to date. Featuring the SATA3 Interface and SandForce 2200 processor with optimized firmware, the SuperTalent TeraNova was built for speed.
By optimizing the transfer rate at various queue depths, the TeraNova delivers excellent performance in a variety of different conditions. Sure the TeraNova boots quickly and posts outstanding benchmark scores (over 500 MB/s for both read and write), but the TeraNova also excels in general responsiveness. Industry standard applications like Photoshop, Premier, Maya and 3DS Max, load, render and perform much faster when compared to countless other SSDs available on the market. The TeraNova also includes new features that enhance reliability as well. In the event of a sudden power loss, the TeraNova reacts, protecting valuable data from corruption before it powers off.
f you are looking to improve workstation productivity across the board, SuperTalent’s new TeraNova is an excellent choice. Available in 60, 120, 240 and 480GB capacities, the TeraNova begins shipping today.
09 December 2011
SuperTalent Enters Pro-Enthusiast SSD Market with TeraNova Series
Super Talent Technology, a leading manufacturer of NAND Flash storage solutions, today announces their fastest 2.5” SSD to date, the SATA3 TeraNova. Targeted at the Pro/Enthusiast seeking extreme performance, the TeraNova is the fastest 2.5” SSD that SuperTalent has released to date. Featuring the SATA3 Interface and SandForce 2200 processor with optimized firmware, the SuperTalent TeraNova was built for speed.
By optimizing the transfer rate at various queue depths, the TeraNova delivers excellent performance in a variety of different conditions. Sure the TeraNova boots quickly and posts outstanding benchmark scores (over 500 MB/s for both read and write), but the TeraNova also excels in general responsiveness. Industry standard applications like Photoshop, Premier, Maya and 3DS Max, load, render and perform much faster when compared to countless other SSDs available on the market. The TeraNova also includes new features that enhance reliability as well. In the event of a sudden power loss, the TeraNova reacts, protecting valuable data from corruption before it powers off.
f you are looking to improve workstation productivity across the board, SuperTalent’s new TeraNova is an excellent choice. Available in 60, 120, 240 and 480GB capacities, the TeraNova begins shipping today.
AMD Announces Fusion ’12 Developer Summit
AMD (NYSE: AMD) today announced that AMD Fusion ’12 will be held June
11-14, 2012 in Bellevue, Washington. The company’s annual developer
summit will return to the Meydenbauer Center and the Hyatt Regency in
Bellevue.
This event will build on the success of AMD Fusion ’11, where more than 700 leaders from industry, academia, and government converged on the forefront of heterogeneous computing. The summit offers an engaging opportunity to learn more about next-generation software development and AMD Fusion System Architecture (FSA), Accelerated Processing Unit (APU) technology, central processing unit (CPU) and graphics processing unit (GPU) processor technologies, and programming methods using industry-standard application programming interfaces (APIs) such as OpenCL, OpenGL, Microsoft DirectCompute and C++ AMP.
“AMD exceeded my expectations with their AMD Fusion Developer Summit this past June,” said Jon Peddie, principal and founder, Jon Peddie Research. “I saw an open and instructive exchange of ideas on software development, tools and APIs, free from the marketing hype that you get at many conferences.”
“As the only provider of world-class APUs, GPUs and CPUs, AMD is leading advancement of heterogeneous computing and OpenCL, both of which have reached a tipping point as demand grows for new user interfaces and immersive computing experiences,” said Manju Hegde, corporate vice president, AMD Fusion Experience Program. “AMD has a history of customer-driven innovation based on industry standards and AMD Fusion ‘12 will be the ideal place for developers, academics and innovators to collaborate around that software innovation.”
Microsoft Gives a Sneak Peek of the Windows Store
Microsoft gave developers a sneak peek at their new iTunes style
‘Windows Store’ last night in San Francisco, making the first time the
new concept has been demonstrated since it was introduced at the BUILD
conference in September.
The Windows Store will sell “Metro-style” apps. Microsoft Metro is the design language of the “live tile” icons for apps that first made an appearance in 2010 on the Windows Phone 7 OS, and is making its way over to the Xbox 360 via a software update.
Customers won’t be able to access the Windows Store until February, when Windows 8 is expected to be released.
Intel, Micron Introduce World’s First 128Gb NAND Device and Mass Production of 64Gb 20nm NAND
Intel Corporation and Micron Technology, Inc., today announced a new
benchmark in NAND flash technology — the world’s first 20 nanometer
(nm), 128 gigabit (Gb), multilevel-cell (MLC) device. The companies also
announced mass production of their 64Gb 20nm NAND, which further
extends the companies’ leadership in NAND process technology.
Developed through Intel and Micron’s joint-development venture, IM Flash Technologies (IMFT), the new 20nm monolithic 128Gb device is the first in the industry to enable a terabit (Tb) of data storage in a fingertip-size package by using just eight die. It also provides twice the storage capacity and performance of the companies’ existing 20nm 64Gb NAND device. The 128Gb device meets the high-speed ONFI 3.0 specification to achieve speeds of 333 megatransfers per second (MT/s), providing customers with a more cost-effective solid-state storage solution for today’s slim, sleek product designs, including tablets, smartphones and high-capacity solid-state drives (SSDs.)
“As portable devices get smaller and sleeker, and server demands increase, our customers look to Micron for innovative new storage technologies and system solutions that meet these challenges,” said Glen Hawk, vice president of Micron’s NAND Solutions Group. “Our collaboration with Intel continues to deliver leading NAND technologies and expertise that are critical to building those systems.”
The companies also revealed that the key to their success with 20nm process technology is due to an innovative new cell structure that enables more aggressive cell scaling than conventional architectures. Their 20nm NAND uses a planar cell structure — the first in the industry — to overcome the inherent difficulties that accompany advanced process technology, enabling performance and reliability on par with the previous generation. The planar cell structure successfully breaks the scaling constraints of the standard NAND floating gate cell by integrating the first Hi-K/metal gate stack on NAND production.
“It is gratifying to see the continued NAND leadership from the Intel-Micron joint development with yet more firsts as our manufacturing teams deliver these high-density, low-cost, compute-quality 20nm NAND devices,” said Rob Crooke, Intel vice president and general manager of Intel’s Non-Volatile Memory Solutions Group. “Through the utilization of planar cell structure and Hi-K/Metal gate stack, IMFT continues to advance the technological capabilities of our NAND flash memory solutions to enable exciting new products, services and form factors.”
The demand for high-capacity NAND flash devices is driven by three interconnected market trends: data storage growth, the shift to the cloud and the proliferation of portable devices. As digital content continues to grow, users expect that data to be available across a multitude of devices, all synchronized via the cloud. To effectively stream data, servers require high-performance, high-capacity storage that NAND delivers, and storage in mobile devices has consistently grown with increased access to data. High-definition video is one example of an application that requires high-capacity storage, since attempting to stream this type of data can create a poor user experience. These developments create great opportunities for high-performance, small-footprint storage, both in the mobile devices that consume the content and the storage servers that deliver it. Intel and Micron noted that the December production ramp of their 20nm 64Gb NAND flash product will enable a rapid transition to the 128Gb device in 2012. Samples of the 128Gb device will be available in January, closely followed by mass production in the first half of 2012. Achievement of this milestone will further enable greater densities and overall fab output, while also helping the companies’ development teams cultivate the expertise required to design complex storage solutions and refine future technologies.
